Dip Power Inductor

1.

High Frequency Ceramic Chip Inductor
Thin film inductor : ( AL series ) Small size of 0201
A Photo Lithographic single layer inductor, Stable inductance in high frequency circuit. Tight tolerance of ±1%,±2% or ±0.1nH, Miniature size of 0201/0402/0603, High SRF, Excellent Q
Wire Wound inductor: (WL series) High SRF, Q , Small size, Wide range
Miniature wire wound chip inductor for fully automated assembly. Wire-wound ceramic construction providing high self resonant frequency and superior high Q, stable solderability. Complete size for 0402/0603/0805/1008/1206, Tight tolerance of ±5%,2%
Multilayer inductor : ( CL series ) Large Capacity, Low cost
For wide 3C (computer, communication, Consumer) applications. High Q, High SRF, Wide inductance range, Tight tolerance of ±5%,±10% or ±0.3nH, Miniature size of 0402/0603/0805,
Application: Cell phone, Pager, Wireless LAN, GPS, VCO, TCXO Circuit , RF transceiver module, Bluetooth module, EMI Countermeasure in RF circuit , High Frequency Communication, Broad band, IT applications.

2.

Power Inductor
Complete sizes and different material for different application need. High current, Low RDC,
Compact, Low profile, Shielded and Un-shielded available, Miniature chip inductor wound on
special ferrite cores.
Application: Pagers, Cell phone, PC, Laptop, DC-DC Converter, DC Power supply, LCD TV