Viking Tech Corp introduces the WB Series of thin film wire bondable chip resistors. The wire bondable surface termination is gold plated over nickel barrier. Sizes 0603 ,0402 and 0201 are currently available and provide the ideal small size for a variety of devices and end products where electrical performance is also a key requirement. Because the resistors are thin film technology, they have excellent overall stability and performance and are available in tolerances as low as .1% and TCR’s down to 25 ppm.

This series is designed for the high speed and portable communications markets, such as cell phones, PDA’s, laptop modems, and blue tooth enabled devices. The “WB” can be used for a variety of other applications including hearing aids, medical probes, and implantable devices. This new “WB” Series brings together the performance of thin film technology with a miniature wire bondable package that is suited for chip scale packaging and integration