SMD 전원 인덕터 (SDIA 시리즈 SDIA0312MT470)
SDIA0312MT470
SMD 소형 파워 인덕터, 작은 크기와 낮은 프로파일, 높은 전류에 대응하며 자기로 보호되는 방패 구조. LCD 디스플레이, DC-DC 컨버터, PDA의 작은 크기에 대한 충격에 강한 구조.
SDIA Series0312 ±20% 47μH 1.45 Ω 0.25A
| 크기 | 허용 오차 | 인덕턴스 | 시험 조건 | DCR (Ω) 최대값 | IDC (A) |
|---|---|---|---|---|---|
| 0312 | ±20% | 47 | 1KHz, 0.25V | 1.45 | 0.25 |
테이프 및 릴 사양 (단위: mm)
| Type | Tape Size | Parts Per Reel | ||
|---|---|---|---|---|
| W | P | 7" | 13" | |
| SDIA0310 | 8 | 4 | 2000 | - |
| SDIA0312 | 8 | 4 | 2000 | - |
| SDIA0315 | 8 | 4 | 2000 | - |
| SDIA0410 | 12 | 8 | - | 5000 |
| SDIA0412 | 12 | 8 | - | 4500 |
| SDIA0415 | 12 | 8 | - | 3000 |
| SDIA0418 | 12 | 8 | - | 3000 |
| SDIA0420 | 12 | 8 | - | 3000 |
| SDIA0430 | 12 | 8 | - | 2500 |
| SDIA0520 | 12 | 8 | - | 2500 |
| SDIA0540 | 12 | 8 | - | 1500 |
| SDIA0620 | 12 | 8 | - | 2000 |
| SDIA0628 | 16 | 8 | - | 1500 |
| SDIA0645 | 16 | 12 | - | 1000 |
| SDIA0840 | 16 | 12 | - | 1000 |
SMT 파워 인덕터 환경 사양
General
| Item | Specification |
|---|---|
| Shelf Storage conditions | Temperature range: 15 ~ 28°C; Humidity: < 80% relative humidity. Recommended product should be used within 12 months from the time of delivery. |
Environmental Test
| Item | Specification | Test Conditions / Test Methods |
|---|---|---|
| High temperature Storage test | No case deformation or change in appearance. Δ L/L ≤10% | Temperature 85 ± 2°C, Time: 48 ± 2 hours, Tested after 1hour at room temperature. |
| Low temperature Storage test | Temperature -25 ± 2°C, Time: 48 ± 2 hours, Tested after 1hour at room temperature. | |
| Humidity test | Temperature 40 ± 2°C, 90~95% relative humidity Time: 96 ± 2 hours Tested after 1hour at room temperature. | |
| Thermal shock test | First -25°C 30minutes then 25°C 10 minutes last 85°C 30 minutes, as 1 cycle. Go through 5 cycles. Tested after 1 hour at room temperature. |
Mechanical Test
| Item | Specification | Test Conditions / Test Methods |
|---|---|---|
| Solderability test | Terminal area must have 90% minimum solder coverage. | Product with Lead-free terminal: Dip pads in flux then dip in solder pot at 245 ± 5°C for 3 seconds. |
| Resistance to Soldering Heat | No case deformation or change in appearance. | Flux should cover the whole of the sample before heating, then be preheated for about 2 minutes over temperature of 130 ~ 150°C. Immersing to 260 ± 5°C for 10 seconds. |
| Vibration test | No case deformation or change in appearance. Δ L/L ≤10% | Apply frequency 10 ~ 55Hz. 1.5mm amplitude in each of perpendicular direction for 2 hours. |
| Shock resistance | Drop down with 981m/s² (100G) shock attitude upon a rubber block method shock testing machine, for 1 time. In each of three orientations. |
리플로우
The Condition Of Reflow (Recommendation):
코드
- 470
- 파일 다운로드
주요 제품
