Multilayer Chip Beads (CBM Series CBM02YTAN700)

Multilayer Chip Beads (CBM Series CBM02YTAN700)

CBM02YTAN700

Multilayer Chip Beads (CBM Series CBM02YTAN700)
Multilayer Chip Beads (CBM Series CBM02YTAN700) Files Download

Multilayer chip bead that is for EMI protection , Low DC resistance, high soldering heat resistance , muliple size availability for all kind of 4C applications, various electronics euqipments.
CBM Series±25% 10K/REEL 0.4 Ω 70Ω 200mA

TolerancePackageTest ConditionDCR (Ω) max.Impedance(Ω)Rated Current (mA) max.
±25%10K/REEL100MHz0.470200

Environmental Characteristics

Electrical Performance Test

Item Specification Test Method
Impedance Refer to standard electrical spec. HP4286A
DCR HP 4338 digital mili-ohm meter

Mechanical Performance Test

Item Specification Test Method
Substrate Bending Test Without deformation cases
Impedance: within ± 30% of initial value
DC Resistance shall be satisfied
Test device shall be soldered on the substrate
Substrate Dimension: 100 x 40 x 0.8mm
Deflection: 3.0mm
Keeping Time: 10sec and then return
Substrate Bending Test - CBM Series
Vibration Appearance: No damage
Impedance: within ± 30% of initial value
DC Resistance shall be satisfied
Test device shall be soldered on the substrate
Oscillation Frequency: 10 to 55 to 10Hz for 1min
Amplitude: 1.5mm (peak-peak)
Time: 2hrs for each axis (X, Y & Z), total 6hrs
Resistance to Soldering Heat No visible damage
Electrical characteristics and mechanical characteristics shall be satisfied
Solder temp: 265 ± 5°C
Immersion time: 6 ± 1sec
Preheating: 100°C to 150°C, 1 minute
Measured after exposure in the room condition for 24hrs
Solder: Sn-3Ag-0.5Cu
Solderability 95% min. coverage of all metabolized area Solder Temperature: 240 ± 5°C
Immersion Time: 3 ± 1sec
Solder: Sn-3Ag-0.5Cu
Terminal Strength Without deformation cases
Impedance: within ± 30% of initial value
DC Resistance shall be satisfied
Solder chip on PCB and applied 10N (1.02Kgf) for 10 sec
Terminal Strength - CBM Series
Temperature Cycle Appearance: No damage
Impedance: within ± 30% of initial value
DC Resistance shall be satisfied
One cycle:
One cycle/step1: -55 ± 3°C for 30 ± 3min
step2: standard atmospheric conditions 5s or less
step3:125 ± 2°C for 30 ± 3min
step4: standard atmospheric conditions 5s or less
Total: 100cycles
Measured after exposure in the room condition for 24hrs
Humidity Resistance Temperature: 60 ± 2°C
Relative Humidity: 90 ~ 95%
Applied Current: Rated Current(maximum value)
Time: 1008 ± 12hrs
Measured after exposure in the room condition for 24hrs
High Temperature Resistance Temperature: 125 ± 2°C
Applied Current: Rated Current(maximum value)
Time: 1008 ± 12hrs
Measured after exposure in the room condition for 24hrs
Low Temperature Storage Life Test Temperature: -55 ± 2°C
Time: 1008 ± 12hrs
Measured after exposure in the room condition for 24hrs
Thermal Shock -55°C ~ 125°C kept stabilized for 30 minutes each for 100 cycles
Measured after exposure in the room condition for 24hrs

☑ Operating Temperature: -55°C ~ 125°C
☑ Storage Temperature: 15 ~ 28°C ; Humidity < 80%RH

Soldering Condition

IR Reflow Soldering
(1) Time of IR reflow soldering at maximum temperature point 260°C: 10s
(2) Time of soldering iron at maximum temperature point 280°C: 3s

Packaging

Packaging - CBM Series
Type Tape Dimensions Reel Dimensions Recommended Pattern Quantity
(EA)
A B T W P F K Tape
Type
A B C D A B C
CBM01 0.38 0.68 1.10 8.0 2.0 3.5 - B 178 60 10 2 0.25 0.69 0.32 15000
CBM02 0.65 1.15 0.80 8.0 2.0 3.5 - B 178 60 10 2 0.50 2.10 0.55 10000
CBM03 1.10 1.90 1.10 8.0 4.0 3.5 - B 178 60 10 2 0.60 2.60 0.80 4000
CBM05 1.55 2.30 1.20 8.0 4.0 3.5 - B 178 60 10 2 0.66 3.23 1.47 4000
CBM04 1.90 3.50 1.40 8.0 4.0 3.5 0.2 A 178 60 10 2 2.20 4.40 2.06 3000
CBM10 2.90 3.60 1.70 8.0 4.0 3.5 0.2 A 178 60 10 2 2.13 4.06 2.74 2000
CBM08 2.90 4.90 1.40 12 4.0 5.5 0.3 A 178 60 14 2 2.70 5.70 2.24 2000
CBM12 3.60 4.90 2.05 12 8.0 5.5 0.3 A 178 60 14 2 2.57 5.90 4.22 1000
CBM20 5.40 5.95 3.42 12 8.0 5.5 0.33 A 330 100 14.5 2 3.05 9.19 6.1 2000
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Multilayer Chip Beads (CBM Series CBM02YTAN700) Manufacturer - Viking

Based in Taiwan, Viking Tech Corporation is one of the prime Multilayer Chip Beads (CBM Series CBM02YTAN700) manufacturers since 1997. And their products are used throughout automotive, electronic device applications.

TS16949/ ISO9001/ ISO14001 and meet AEC-Q200 standards, Viking has been offering anti-sulfur, anti-surge, pulse, high voltage, high power precision resistors including thin/ thick film resistors, automotive resistors, melf resistors, current sense resistors, etc. Low noise, low TC, high power inductors such as rf inductors, chip inductors, power inductors, variable inductors, ferrite chip inductors, shielded inductors, wire wound inductors and dip inductors.

Viking has been offering customers high quality power resistors, power inductors and aluminum electrolytic capacitors with solid reputation. Both with advanced technology and 20 years of experience, Viking makes sure to meet each customer's demands.


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