Wire Wound Type Power Inductor

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Wire Wound Type Power Inductor

MLP04MTR33

Wire Wound Type Power Inductor
Wire Wound Type Power Inductor Files Download

Wirewound ferrite chip high power inductor , small sizes , closed magnetic circuit avoids crosstalk , suitable for high density installation and re-flow soldering. Used in all kind electronic devices, computing, converters.
MLP Series1004 ±20% 0.33μH 0.026 Ω 6A 4A

SizeToleranceInductanceTest ConditionDCR (Ω) max.I sat (A) max.I rms (A) max.
1004±20%0.331MHz, 1mA0.02664

High Current Electrical Specifications

MLPH06 (0806) Wire Wound Type Power Inductor

CodesInductance (uH)ToleranceTest ConditionDCR (mΩ) max.Isat (A) max.Irms (A) max.
R470.47± 20%1MHz, 1V305.304.05
1R01.0± 20%1MHz, 1V603.303.00
1R51.5± 20%1MHz, 1V993.102.20
2R22.2± 20%1MHz, 1V1402.452.00

MLPH04 (1004) Wire Wound Type Power Inductor

R470.47± 20%1MHz, 1V296.004.40
1R01.0± 20%1MHz, 1V524.003.10
2R22.2± 20%1MHz, 1V1103.002.10

MLPH08 (1008) Wire Wound Type Power Inductor

CodesInductance (uH)ToleranceTest ConditionDCR (mΩ) max.Isat (A) max.Irms (A) max.
R470.47± 20%1MHz, 1V226.204.90
1R01.0± 20%1MHz, 1V444.303.30
2R22.2± 20%1MHz, 1V893.202.20

Operating Temperature range: -40°C to +125°C

Environmental Characteristics

Electrical Performance Test

ItemRequirementTest Method
InductanceRefer to standard electrical characteristic spec.HP4285A
DC Resistance RDCmicro-ohm meter.
IsatDC current will cause a 30% inductance reduction form initial value.
IrmsDC current will cause coil temp. rising to 40℃ whichever is smaller.

Mechanical Performance Test

ItemRequirementTest Method
Resistance to Soldering HeatAppearance: No damage
More than 95% of the terminal.
Electrode should be covered with solder.
Inductance: within ± 20% of initial value
Flux: Rosin
Solder Temperature: 260 ± 5°C
Immersion Time: 10 ± 1 sec.
Adhesive TestNo mechanical damage
Soldering the products on PCB after the pulling test force>5N
Reflow temperature: 245°C it shall be soldered on the substrate applying direction parallel to the substrate
Apply force(F): 5 N
Test time: 10 sec
Temperature CycleNo mechanical damage
Inductance: within ± 20% of initial value
Temperature: -50 ~ 125°C for 30 minutes each
Cycle: 500cycles
Measurement: at ambient temperature 24 hours after test completion
Dry Heat TestTemperature: 85 ± 2°C
Testing time: 500 hrs
Applied current: full rated current
Measurement: at ambient temperature 24 hours after test completion
Humidity TestTemperature: 60 ± 2°C, Humidity: 90 ~ 95% RH
Testing time: 500 hrs
Applied current: full rated current
Measurement: at ambient temperature 24 hours after test completion

☑Storage Temperature: 5~40°C ; Humidity:<65%RH

Reflow

Recommendable Reflow Soldering

Recommendable Reflow Soldering

Packaging

Reel Specifications (Unit: mm)

TypeABCWTQuantity (EA)Reel Specifications - MLP
MLP03178 ± 160.0 + 0.513.0 ± 0.29.00 ± 0.512.0 ± 0.153,000
MLP05178 ± 160.0 + 0.513.0 ± 0.29.00 ± 0.512.0 ± 0.153,000
MLP(H)06178 ± 160.0 + 0.513.0 ± 0.29.00 ± 0.512.0 ± 0.153,000
MLP(H)04178 ± 160.0 + 0.513.0 ± 0.29.00 ± 0.512.0 ± 0.153,000
MLP(H)08178 ± 160.0 + 0.513.0 ± 0.29.00 ± 0.512.0 ± 0.153,000
MLP10178 ± 160.0 + 0.513.0 ± 0.29.00 ± 0.512.0 ± 0.153,000

Tape Specifications (Unit: mm)

TypeA0B0K0tTape Specifications - MLP
MLP031.45 ± 0.102.20 ± 0.101.12 ± 0.100.22 ± 0.05
MLP051.45 ± 0.102.20 ± 0.101.12 ± 0.100.22 ± 0.05
MLP061.80 ± 0.102.20 ± 0.101.15 ± 0.100.22 ± 0.05
MLPH061.82 ± 0.052.23 ± 0.051.15 ± 0.050.22 ± 0.05
MLP042.50 ± 0.103.00 ± 0.101.60 ± 0.100.25 ± 0.05
MLPH042.25 ± 0.052.80 ± 0.101.35 ± 0.100.22 ± 0.05
MLP082.50 ± 0.103.00 ± 0.101.60 ± 0.100.25 ± 0.05
MLPH082.25 ± 0.052.80 ± 0.101.35 ± 0.100.22 ± 0.05
MLP102.80 ± 0.103.45 ± 0.101.34 ± 0.100.23 ± 0.05

Code

  • R33
Files Download


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